V1

This is the GDS used

Just use layer 1 for now (dots, not dicing borders or wafer outline).

Each chip has a 7 mm pattern with 500 micron holes and 500 micron space between holes.

Spin coating

Resist: AZ1518
Spin speed: 4000 rpm
Spin time: 120 seconds
Soft bake: 115C for 90 seconds

Exposure

Dose: 250 (Appropriate range is 140-340)

Development

Developer: swirl in MF26A, 60 seconds
UPW, 10 seconds
UPW, 60 SECONDS
N2 dry